Universal

Key Features:

• Universal Compatibility: Suitable for various ICs, SMD, and BGA chip reballing applications
• High Precision Design: Ensures accurate solder paste placement and consistent results
• Durable Construction: Made from high-quality, heat-resistant material for long-term use
• Black Coating Finish: Improves visibility and reduces glare during soldering work
• Reusable & Easy to Clean: Can be used multiple times with proper maintenance
• Professional & DIY Use: Perfect for mobile repair, PCB rework labs, and electronics projects

Applications:

• Mobile phone motherboard repair
• BGA and SMD reballing
• PCB prototyping and repair
• IC replacement and rework