The Auto Botix 0.35mm Solder Balls are premium-quality leaded solder spheres specially designed for BGA reballing, IC repair, and chip-level rework applications. Made from high-performance Sn63/Pb37 eutectic alloy, these solder balls ensure smooth melting, strong joints, and reliable electrical connections.
With a precise 0.35mm diameter, they are ideal for fine-pitch components commonly found in mobile phones, laptops, GPUs, and other advanced electronic devices. The eutectic composition (63% Tin, 37% Lead) provides a sharp melting point of 183°C, enabling clean and consistent soldering without a plastic transition phase
