Solder

Key Features:

• Sn63Pb37 Eutectic Alloy: Ensures instant melting and solidification for strong, shiny solder joints
• 0.35mm Uniform Size: Perfect for fine-pitch BGA, SMD, and chip-level repairs
• Low Melting Point (183°C): Reduces thermal stress on sensitive components
• High Sphericity & Accuracy: Provides precise placement and reliable connectivity
• Excellent Wetting Performance: Improves bonding strength and reduces defects